13/07921 - ALD system

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This tender is concerning a compact table-top Thermal Atomic Layer Deposition system (ALD) for research applications with focus on high flexibility regarding source materials (metals and dielectrics), substrate materials and sizes. It must be possible to run the precursors concurrently thereby enabling multilayer stacks of thin films. The system should be upgradable to Plasma ALD. To secure high thermal uniformity the reactor should be a hot wall chamber. All components of the system should be easy to access and maintain. Regarding the precursor delivery system focus must be on fast gas valves, high thermal control of the precursors from bottle to reaction chamber, and fast purge/cycle times securing high precission in the thin film layer control. The possibility for stacked substrates to increase throughput would have high priority. The instrument will be placed in a multi-user environment so it must be very user friendly and robust. It is essential that the tool supplier can guarantee fast and reliable service even without a service contract.