This tender is concerning a highly flexible multi-purpose semiconductor furnace system with vacuum capability for up to 50 wafers of 200 mm diameter. It is imperative that the furnace system is prepared for safe inflammable and poisoned gas atmosphere processing, a.o. for H2 concentrations (in N2) from 0% to 100%, even in case of tube break or gas leakage from the tube. The safe solution must be described in detail in the bid. Regarding the flexibility it is required that the quartz glass reactors/in-liners are easily and quickly replaced (< 10 min) making multi-purpose processing with dedicated glassware possible. The glass change / multi-purpose solution must be described in detail in the bid. The furnace must cover the temperature range from Room Temperature to 1150 °C ±0.5 °C with fast ramping (min. 100 K/min) and fast cool down. The temperature uniformity along a wafer boat of 50 wafers should be maximum ±2 K. The obtainable base pressure in the furnace should be 5x10-6 mbar or lower and the oxygen level should be in the range of 1 ppm. In stand-by the furnace should be kept at room temperature meaning that a normal processing sequence would be: Loading substrates at room temperature, ramping temperature up, processing, and rapidly cool down again. All components of the system should be easy to access and maintain. Regarding the gas delivery system all tubing should be made in stainless steel and all assemblies should be welded except for components which need to be replaceable (such as mfc’s, valves, filters etc) where Swagelok fittings or a similar standard should be used. The instrument will be placed in a multi-user environment so it must be very user friendly and robust. It is essential that the tool supplier can guarantee fast and reliable service even without a service contract.