Short description
This tender is concerning a multi-chamber high vacuum sputtering deposition system for R and D and pi-lot production applications with focus on high flexibility regarding source materials (metals, semiconductors, and dielectrics), substrate materials and substrate sizes. The system will be used for sputter deposition of various thin films onto standard sized si-wafers (mainly 100 mm and 150 mm) but it should also be possible to load smaller chips using carriers. It should be possible to deposit metal oxides, metal nitrides, and pure metal thin films and semiconductors in various sputtering modes (DC/RF/pulsed DC/HiPIMS/reactive sputtering).