Universitetet i Oslo 971 035 854 Postboks 1032 Blindern Oslo NO - 0315 Ketil Sand +47 22857759 ketil.sand@mn.uio.no www.uio.no Automatic wire bond tester ANSK-0217-18 The primary purpose of the equipment is the quality assurance of micro-electronic bond wire connections, most importantly pull testing according to “MIL-STD-883 Method 2011.9 Condition D”. The equipment should be suitable for both destructive and non-destructive tests, covering a measurement range of 1-100 g and a resolution better than 0,1 g. The commission should also include a shear testing cartridge, covering a measurement range of 0,5-50 kg. The equipment should be built on an automatic motion machine platform, allowing programmed test sequences, and include a pattern recognition system for automatic alignment. The commission should also include necessary software for the analysis and presentation of test results. Considering future UiO micro-electronic assembly needs the machine platform must be reconfigurable. For a possible later commission the supplier should offer an optional gold-ball wire bonder head. 1250000.00 Oslo. The primary purpose of the equipment is the quality assurance of micro-electronic bond wire connections, most importantly pull testing according to “MIL-STD-883 Method 2011.9 Condition D”. The equipment should be suitable for both destructive and non-destructive tests, covering a measurement range of 1-100 g and a resolution better than 0,1 g. The commission should also include a shear testing cartridge, covering a measurement range of 0,5-50 kg. The equipment should be built on an automatic motion machine platform, allowing programmed test sequences, and include a pattern recognition system for automatic alignment. The commission should also include necessary software for the analysis and presentation of test results. Considering future UiO micro-electronic assembly needs the machine platform must be reconfigurable. For a possible later commission the supplier should offer an optional gold-ball wire bonder head. Exchangable module for wire bonding. The primary purpose of the equipment is the quality assurance of micro-electronic bond wire connections, most importantly pull testing according to “MIL-STD-883 Method 2011.9 Condition D”. The equipment should be suitable for both destructive and non-destructive tests, covering a measurement range of 1-100 g and a resolution better than 0,1 g. The commission should also include a shear testing cartridge, covering a measurement range of 0,5-50 kg. The equipment should be built on an automatic motion machine platform, allowing programmed test sequences, and include a pattern recognition system for automatic alignment. The commission should also include necessary software for the analysis and presentation of test results. Considering future UiO micro-electronic assembly needs the machine platform must be reconfigurable. For a possible later commission the supplier should offer an optional gold-ball wire bonder head. With a view toward clean room floor space economy it is paramount that the pull testing and the optional gold-ball wire bonder are offered on a single reconfigurable machine platform. The UiO clean room does not have room for two separate machines. MPE Nordic AB is the only supplier who can deliver a reconfigurable solution. 2018-04-05 MPE Nordic AB 556682-4198 Åkerivegen 11 Sødertelje S15-242 +46 855065659 lb@mpenordic.com 1250000.00 1250000.00 Universitetet i Oslo Postboks 1032 Blindern Oslo 0315 +47 22857759 ketil.sand@mn.uio.no www.uio.no 2018-04-09
See tender at TED: http://ted.europa.eu/udl?uri=TED:NOTICE:154155-2018:TEXT:EN:HTML